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HS Code and Harmonized Tariff Schedule of Canada
HS NoSS Description of Goods Unit of Meas.  MFN Tariff Applicable Preferential Tariffs
1905.90.9090Bread, pastry, cakes, biscuits and other bakers' wares, whether or not containing cocoa; communion wafers, empty cachets of a kind suitable for pharmaceutical use, sealing wafers, rice paper and similar products. - Other - Other - OtherKGM11%CCCT, LDCT
3818.00.00 Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.KGMFreeCCCT, LDCT
3818.00.0010Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. - ElementsKGMFreeCCCT, LDCT
3818.00.0020Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. - CompoundsKGMFreeCCCT, LDCT
44.10 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances.   
4410.11 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board   
4410.11.1000Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Unworked or not further worked than sanded; Whether or not painted, edge or face worked, but not otherwise worked or surface coveredMTQFreeCCCT, LDCT
4410.11.90 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - OtherMTQFreeCCCT, LDCT
4410.11.9011Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - Surface-covered with decorative laminates of plastics: - With polymers of vinylMTQFreeCCCT, LDCT
4410.11.9019Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - Surface-covered with decorative laminates of plastics: - OtherMTQFreeCCCT, LDCT
4410.11.9090Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - OtherMTQFreeCCCT, LDCT
4410.12.0000Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Oriented strand board (OSB)MTQFreeCCCT, LDCT
4410.19 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other   
4410.19.1000Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Unworked or not further worked than sanded; Waferboard; Whether or not painted, edge or face worked, but not otherwise worked or surface coveredMTQFreeCCCT, LDCT
4410.19.90 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - OtherMTQFreeCCCT, LDCT
4410.19.9011Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - Surface-covered with decorative laminates of plastics: - With polymers of vinylMTQFreeCCCT, LDCT
4410.19.9019Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - Surface-covered with decorative laminates of plastics: - OtherMTQFreeCCCT, LDCT
4410.19.9090Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - OtherMTQFreeCCCT, LDCT
4410.90.00 Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - OtherMTQFreeCCCT, LDCT
4410.90.0010Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Other - Whether or not painted, edge or face-worked, but not otherwise worked or surface coveredMTQFreeCCCT, LDCT
4410.90.0090Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Other - OtherMTQFreeCCCT, LDCT
8542.39.0022Electronic integrated circuits. - Electronic integrated circuits: - Other - Hybrid integrated circuits: - Unmounted chips, dice or wafersNMBFreeCCCT, LDCT
84.86 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories.   
8486.10.0000Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. - Machines and apparatus for the manufacture of boules or wafersNMBFreeCCCT, LDCT
8486.20.0000Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. - Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuitsNMBFreeCCCT, LDCT
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