| 8540.89.00 | 40 | Diodes, triodes and tetrodes | No. | | | |
| 8540.89.00 | 60 | Light-sensing tubes | No. | | | |
| 8540.91.15 | 00 | Front panel assemblies | X | 5.4% | Free (A+,AU,B,CA, CL,D,E,IL,J,JO, MX,P,SG) 3.7% (BH) 3.5% (MA) | 35% |
| 8540.91.20 | 00 | Deflection coils | X | Free | | 35% |
| 8540.99.40 | 00 | Electron guns; radio frequency (RF) interaction structures for microwave tubes of subheadings 8540.71 through 8540.79, inclusive | X | Free | | 35% |
| 8541.10.00 | | Diodes, other than photosensitive or light-emitting diodes | | Free | | 35% |
| 8541.10.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.10.00 | 60 | Microwave | No. | | | |
| 8541.10.00 | 70 | With a maximum current of 0.5 A or less | No. | | | |
| 8541.21.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.29.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.30.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.30.00 | | Thyristors, diacs and triacs, other than photosensitive devices | | Free | | 35% |
| 8541.40.60 | | Other diodes | | Free | | 35% |
| 8541.40.60 | 10 | Unmounted chips, dice and wafers | No. | | | |
| 8541.40.60 | 20 | Assembled into modules or made up into panels | No. | | | |
| 8541.40.70 | | Transistors | | Free | | 35% |
| 8541.40.70 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.40.80 | 00 | Optical coupled isolators | No. | Free | | 35% |
| 8541.50.00 | | Other semiconductor devices | | Free | | 35% |
| 8541.50.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.60.00 | | Mounted piezoelectric crystals | | Free | | 35% |
| 8541.90.00 | 00 | Parts | X | Free | | 35% |
| 8542.31.00 | 00 | Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits | No. | Free | | 35% |
| 8542.32.00 | 01 | Not over 128 megabits | No. | | | |
