| 4411.92 | | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 | | | |
| 4411.92.10 | | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board | KGM | Free | CCCT, LDCT |
| 4411.92.10 | 11 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Not mechanically worked or surface covered: - Doorskins | KGM | Free | CCCT, LDCT |
| 4411.92.10 | 19 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Not mechanically worked or surface covered: - Other | KGM | Free | CCCT, LDCT |
| 4411.92.10 | 21 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board: - Doorskins | KGM | Free | CCCT, LDCT |
| 4411.92.10 | 29 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board: - Other | KGM | Free | CCCT, LDCT |
| 4411.92.90 | | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Other | KGM | 6% | CCCT, LDCT |
| 4411.92.90 | 10 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Other - Doorskins | KGM | 6% | CCCT, LDCT |
| 4411.92.90 | 20 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Other - Laminate flooring | MTK | 6% | CCCT, LDCT |
| 4411.92.90 | 90 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm3 - Other - Other | KGM | 6% | CCCT, LDCT |
