| 8536.69.40 | 20 | Cylindrical multicontact connectors | No. | | | |
| 8541 | | Diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes; mounted piezoelectric crystals; parts thereof: | | | | |
| 8541.40 | | Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes: | | | | |
| 8541.50.00 | | Other semiconductor devices | | Free | | 35% |
| 8802 | | Other aircraft (for example, helicopters, airplanes); spacecraft (including satellites) and suborbital and spacecraft launch vehicles: | | | | |
| 8802.11.00 | | Helicopters: | | | | |
| 8803.30.00 | | Other parts of airplanes or helicopters | | Free | | 27.5% |
| 9030.82.00 | 00 | For measuring or checking semiconductor wafers or devices | No. | Free | | 40% |
| 9031.41.00 | | For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices | | Free | | 50% |
| 9031.41.00 | 20 | For inspecting photomasks or reticles used in manufacturing semiconductor devices | No. | | | |
| 9031.41.00 | 40 | For inspecting semiconductor wafers or devices: | | | | |
| 9031.49.70 | 00 | For inspecting masks (other than photomasks) used in manufacturing semiconductor devices; for measuring surface particulate contamination on semiconductor devices | No. | Free | | 50% |
| 9031.80.40 | 00 | Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles | No. | Free | | 40% |
| 9802.00.90 | 00 | Textile and apparel goods, assembled in Mexico in which all fabric components were wholly formed and cut in the United States, provided that such fabric components, in whole or in part, (a) were exported in condition ready for assembly without further fabrication, (b) have not lost their physical identity in such articles by change in form, shape or otherwise, and (c) have not been advanced in value or improved in condition abroad except by being assembled and except by operations incidental to the assembly process; provided that goods classifiable in chapters 61, 62 or 63 may have been subject to bleaching, garment dyeing, stone-washing, acid-washing or perma-pressing after assembly as provided for herein | | Free (see U.S. note 4 of this subchapter) | | |
| 9810.00.25 | 00 | Altars, pulpits, communion tables, baptismal fonts, shrines, mosaics, iconostases, or parts, appurtenances or adjuncts of any of the foregoing, whether to be physically joined thereto or not, and statuary (except granite or marble cemetery headstones, granite or marble grave markers and granite or marble feature memorials, and except casts of plaster of Paris, or of compositions of paper or papier-m鈉h￠/ | X | Free | | Free |
| 9820.11.24 | | Apparel articles both cut (or knit-to-shape) and sewn or otherwise assembled in one or more such countries, provided that such apparel articles of such fabrics or yarn would be considered an originating good under the terms of general note 12(t) to the tariff schedule without regard to the source of the fabric or yarn if such apparel article had been imported from the territory of Canada or the territory of Mexico directly into the customs territory of the United States | | | Free | |
| 9821.11.07 | | Fabrics or yarns, provided that such apparel articles of such fabrics or yarns would be considered an originating good under the terms of general note 12(t) to the tariff schedule without regardto the source of the fabric or yarn if such apparel article had been imported from the territory of Canada or the territory of Mexico directly into the customs territory of the United States | | | Free | |
